There are basically two types of burn-in sockets, clamshell and open-top. Sockets typically are made with high temperature plastics, conductive metal contacts, and various springs and hardware. Whether testing is a few minutes or hour, the socket used must work each time another DUT is attached. In other cases, the DUT is only removed after thousands of hours of testing. ![]() In some burn-in processes, the DUT is removed after a few minutes and then the process is repeated with a different DUT. The burn-in process can then be repeated. This means the DUT can be removed and replaced with another DUT when the test interval has been completed. The interface to the semiconductor device (or DUT) is always semi-permanent. The interface at the PCB can either be permanent (soldered) or compression-mounted (semi-permanent). A feedback loop is set up between the heater, fan, and sensor to allow more individual temperature control over each DUT in the oven.īurn-in boards with thermal controlled sockets from Micro Control Company.īurn-in sockets are a non-permanent connection from a PCB to a semi-conductor device. The sockets are equipped with features such as heat sinks, temperature sensors, fans, and heaters to help individual DUTs achieve a more uniform burn-in temperature. To smooth these variations out, the ovens are set at lower temperatures, such as 85☌ (185☏) to 100☌ (212☏). They also saw variations in the heat being generated by the individual DUT. They noticed variations in temperature over the width, depth, and stack height of boards in the oven. The automotive industry has been pushing for burn-in temperatures of 200☌ (392☏) to 220☌ (428☏).Įngineers have lately started reviewing DUT temperatures in ovens more closely. Ovens used for burn-in testing are evolving to accommodate the increasing temperatures needed to simulate harsh environment operating conditions. ![]() The DUT will also generate its own heat within the oven as it processes electrical signals. Plastronics’ sockets can be used to test at high temperatures, high power, and other factors based on the application needs.īurn-in ovens provide a stressful test environment by circulating heat around the DUT. The components perform as expected but over time, simply wear out. In the third stage, components fail due to age as the product reaches the end of its useful lifespan. When a component fails in the second stage, it is typically a random failure attributable to a materials problem or an operational irregularity, such as a power surge or change in use pattern. The first stage is an early failure, typically due to improper specification or a manufacturing problem with the component. Components have the potential to fail at three points in their lifespan. ![]() ![]() The object is to eliminate defective components or those with short lifespans before they can become a factor in a system failure. During burn-in, the component endures extreme operating conditions, including temperature extremes, high use cycles, and high voltages. One important testing protocol is known as burn-in, a testing process designed to detect early failures in components and reduce the potential for defects and failures in the field. Components may be subject to testing that evaluates factors such as the durability of materials, their ability to withstand mating and unmating cycles, signal integrity, regulatory compliance, and other benchmarks. Components reliability can be assured through a variety of testing protocols that are based on the type of component, the type of system in which the component will be used, the product or system operating environment, and adherence to country- and industry-specific regulations, among other factors. Updated: November 30th, 2021 This rigorous testing process helps ensure that connectors are durable enough to withstand temperature extremes, use cycles, and other operating conditions.ĭesigners need to know that the components they specify will perform as promised in a finished product.
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